How to choose a motherboard heating platform?

   The popularity of mobile phones is getting higher and higher. Almost everyone has one. There are more and more people who repair mobile phones by themselves at home. The choice of maintenance tools is also very important. Here, let's first understand how to choose a motherboard heating platform.

    The following takes SS-T12A Desoldering Pre-Heating Station and JC iHeater Preheat Desoldering Station as examples. Learn how to choose a motherboard heating platform.

  1. JC iHeater Preheat Desoldering Station     
   JC iHeater Preheating Desoldering Station Heating Plate for iPhone X-13 Pro Max FACE ID Android Motherboard Repair. It is a great motherboard preheating separating desoldering tools. The third generation JC iHeater iPhone X-13 Pro Max motherboard CPU IC screen frame FACE ID point projector Android phone repair warm-up station.


   It has many features:

  • Aixun intelligent desoldering station (third generation).
  • Smart desoldering/rework hot plate with temperature control.
  • Intelligent temperature control/protection motherboard/solder desoldering.
  • 70-260°C safe and adjustable, digital tube display, double button design.
  • Adopt the integrated design of welding and desoldering.

  • Disassemble the motherboard.
  • Makes logic board separation faster and easier.
  • Modular design, future compatible.
  • Compatible with iPhone X, XS, XS Max, 11, 11 Pro, iPhone 11 Pro Max, 12, 12 mini, 12 pro, 12 pro max, 13, 13 mini, 13 pro, 13 pro max.

    2. SS-T12A Desoldering Pre-Heating Station

   SUNSHINE SS-T12A iPhone X upper/lower motherboard preheating station adopts special heating design and precise temperature control ability, which can accurately locate the required heating parts. SUNSHINE SS-T12A has EU, Australia and US plugs, 110V or 220V for your choice. It uses high-purity copper to ensure heat transfer, is not easy to deform, and is durable and wear-resistant.


   Its features are as follows:

  • The iP-X motherboard is dismantled by a 185-degree process. From our welding to the fine analysis of the iP-X paste, the thermal design and precision control of the SS-T12A are also presented one by one.

  • SS-T12A needs to remove the area of ​​IP-X board to prevent heat generation.
  • The dual bayonet design ensures that the iP-X motherboard is stable on the stage.
  • High heat is used as copper film to ensure uniform heat transfer.


    The above is the introduction of the two motherboard heating platforms. Of course, if you need a more professional mobile phone repair guide, you can visit our Phonefix website to see.




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